SOI Technical Advantages

  • 20% to 50% increase in switching speed compared to similar circuits built on conventional “bulk” silicon wafers
  • Ability to operate at lower voltages (less battery power drain and chip heating)
  • Reduction of the need for error correction operations in high-speed servers and memory arrays operating in environments prone to cosmic ray particle showers
  • Increased circuit packing density due to simplification of the lateral and vertical isolation structures, increasing chip yield and die count per wafer